Abstract
In this paper the model of cracks nucleation on materials interface is developed. This model is based on the alliance of the bridged crack model and the thermofluctuational strength theory. The using of the bridged crack model allows to consider a zone of weakened bonds on a material interface as a bridged interface crack and the thermofluctuational theory determines the law of bonds rupture along this zone. The bond destruction in the crack bridged zone is modelled by the bonds compliance variation along the crack bridged zone and over time. Numerical calculations were performed for the physical and mechanical parameters of the joint materials and bonds which are used in microelectronics applications. The results of computation are presented and discussed.
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