Abstract
Silicon wafer geometry is stringently controlled at present in the semiconductor industry. In particular, surface flatness must comply with strict standards because it can affect the success of various downstream manufacturing processes. A double-sided polishing (DSP) process serves as the standard finishing process in the industrial manufacture of large diameter silicon wafers. However, nonuniformities in the removal distribution on a wafer in DSP processes cause deterioration of surface flatness of the wafer. In this study, we derive the relation between DSP conditions and the uniformity of the removal distribution and propose better DSP conditions via kinematic modeling of a DSP process.
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