Abstract
Abstract Curing kinetics of an industrially important printed-circuit board (PCB) base material (epoxy-phenol/glass fillers) were studied from isothermal differential scanning calorimetry (DSC) measurements between 150 and 190 °C. The extent of cure was calculated by integration of the exothermic peak and normalization by the total heat of reaction (obtained by non-isothermal DSC). The kinetic profiles show two regimes: one fast, and one slower. The completion was reached above 180 °C. The kinetic parameters have been elucidated using an isoconversional model-free kinetic method. The linearity of Arrhenius plots was satisfactory. The apparent activation energy of curing reaction has been found to increase with the degree of conversion. The elucidation of the kinetic parameters allows us to propose an accurate and predictive description of the curing kinetics of the composite until a degree of conversion of 50%. Finally, we discuss how these kinetic measurements and models can be completed and optimized.
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