Abstract
The conductivity of silver chloride was measured as a function of copper(I) concentration and temperature in the range of 150–372°C. The data were analyzed in terms of dissociation of the copper ions from lattice sites to interstitital sites in which the copper ions are mobile. The degree of dissociation varies from 0·125 at 161°C to 0·175 at 298°C. The enthalpy of formation of the copper interstitial plus concomitant vacancy is 0·75 eV. In the temperature range investigated, the copper interstitial has nearly the same mobility as the silver vacancy and has an activation enthalpy of motion of 0·35 eV. Evidence is presented for its migration by a direct jump mechanism.
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