Abstract
A masking concept for ion-beam shadow printing is described. Resist layers have been exposed through thin single-crystal silicon foils in the channeling direction, using a collimated helium beam with an initial energy of 300–2000 keV. The masking technique employs the dechanneling effect of a thin metal layer as well as the difference in energy loss for random and for channeling directions. The method is suitable for the replication of high-resolution structures using proximity exposure.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
