Abstract
This paper provides an overview of the solution and application of the three-dimensional heat conduction equation for a rectangular-shaped, multilayer structure with discrete surface heat sources. A Fourier series expansion is used to represent both the heat source function and temperature solution. Boundary conditions consist of insulated edges and Newtonian surface cooling. Computer programs based this method are used to demonstrate the solution of a heat sinked hybrid circuit package mounted on an epoxy glass circuit board.
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