Abstract
The potential for the enhancement of heat transfer by thermal radiation within enclosures containing modern electronic equipment is established on the basis of a diffuse-gray analysis of the thermal radiation heat transfer in a rectangular enclosure with discrete heat sources when the medium enclosed is radiatively nonparticipating. The geometry considered is representative of a unit cell of parallel-circuit board inside of modern electronic equipment. The results are presented for heat fluxes in the range of 0.01 to 25 W/cm 2, emissivity values of 0.1 to 1.0, the ratios of the distance between center line of the heaters to the spacing between heaters of 1 to 3, and enclosure height-to-width (H/W) ratios of 1 to 4. For the problem considered, the results indicate the following: (1) Surface temperature reduction of at least 50°C can be achieved when emissivities of the surfaces of the enclosure are increased from 0.25 to 1.0. (2) The influence of H/W is, however less significant. (3) The surface temperature of the constant-flux heat sources is essentially uniform. Also a simple dimensionless correlation between the average temperature of the heat sources to the heat flux supplied to them is presented for use by designers for estimation purposes.
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