Abstract
The combined effect of total ionization dose (TID) and time-dependent dielectric breakdown (TDDB) of partially depleted silicon-on-insulator (PDSOI) NMOSFET is investigated. First, the effect of TDDB on the parameter degradation of the devices was investigated by accelerated stress tests. It is found that TDDB stress leads to a decrease in off-state current, a positive drift in threshold voltage, and a reduction of maximum transconductance. Next, the degradation patterns of TID effect on the devices are obtained. The results show that the parameter degradation due to gamma radiation is opposite to the TDDB stress. Finally, the combined effect of TID and TDDB is investigated. It is found that the drift of the devices’ sensitive parameters due to TDDB stress decreases in a total dose of gamma radiation environment. The TDDB lifetime is shortened, but the pattern of gate current change remains unchanged. The failure mechanism of the gate oxide layer under TDDB stress is not changed after irradiation.
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