Abstract
Reliable operation of nanoscale CMOS quantum dot devices at cryogenic temperatures fabricated with standard manufacturing techniques is of great importance for quantum computing applications. We investigated the very low temperature behavior of an Ultra Thin Body and Buried oxide (UTBB) Fully Depleted Silicon-On-Insulator (FD-SOI) quantum dot device fabricated using the standard fabrication process of STMicroelectronics. The performance of the quantum dot device is simulated and analyzed using the 3D Quantum Technology Computer Aided Design (QTCAD) software recently developed by Nanoacademic Technologies, achieving convergence down to 1.4 K. In this paper we present preliminary simulation results and compare them with experimental data collected from the measurements on a device with the same geometry.
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