Abstract
The interfacial reactions of Sn, Sn–3.0wt% Ag–0.5wt% Cu (SAC), Sn–0.7wt% Cu (SC), Sn–58wt% Bi (SB) and Sn–9wt% Zn (SZ) lead-free solders with an Au/Pd/Ni/brass multilayer substrate were systematically investigated in this study. The results revealed that (Cu, Ni)6Sn5 and CuZn phases were formed at the interface in the Sn, SAC, and SC solders reacting with Au/Pd/Ni/brass systems. In the SB/Au/Pd/Ni/brass system, (Ni, Cu)3Sn4, (Cu, Ni)6Sn5 and CuZn phases were formed at the interface. The CuZn5, Pd2Zn9, Ni5Zn21 and Cu5Zn8 phases were formed in the SZ/Au/Pd/Ni/brass system.
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