Interfacial Reactions in the Ni/Sn-xZn/Cu Sandwich Couples

Abstract

The interfacial reactions in Ni/Sn-xZn/Cu sandwich couples which were reflowed at 270°C for 1 h and then aged at 160°C for 1–1000 h were investigated. When the 1000-μm-thick Sn-Zn alloy reacted with Ni and Cu in this couple, the results indicated that the (Ni, Cu)3Sn4, (Ni, Cu)5Zn21, and Ni5Zn21 phases were formed at Sn-1Zn/Ni, Sn-5Zn/Ni, and Sn-9Zn/Ni interfaces for 1 h reflowing, respectively. After 1000 h aging, each intermetallic compound (IMC) was converted to (Cu, Ni, Zn)6Sn5, (Ni, Cu, Sn)5Zn21/Ni5Zn21, and Ni5Zn21 (two layers) phases in the related couples. On the Cu side, the Cu6Sn5 phase in the Sn-1Zn/Cu interface and the Cu5Zn8 phase in the Sn-5Zn/Cu and Sn-9Zn/Cu interfaces were observed when the couple was reflowed at 270°C for 1 h. After 100 h aging, the (Cu, Ni, Zn)6Sn5, Cu5Zn8/(Cu, Zn)6Sn5, and Cu5Zn8 phases were formed at the Sn-1Zn/Cu, Sn-5Zn/Cu and Sn-9Zn/Cu interfaces. When the Sn-Zn alloy thickness was decreased to 500 μm, the (Cu, Ni, Zn)6Sn5 phase at the Sn-1Zn/Ni interface and the (Ni, Cu, Sn)5Zn21 phase at the Sn-5Zn/Ni and Sn-9Zn/Ni interfaces were observed after 1 h reflowing. When the couple was aged at 160°C for 1000 h, each IMC was converted to (Cu, Ni, Zn)6Sn5 and Cu5Zn8/(Cu, Ni, Sn)Zn/Ni5Zn21 phases at the Sn-1Zn/Ni and Sn-(5, 9)Zn/Ni interfaces. (Cu, Ni, Zn)6Sn5 and Cu5Zn8 were, respectively, formed at the Sn-1Zn/Cu and Sn-(5, 9)Zn/Cu interfaces for 1 h reflowing. After 100 h aging, the IMCs were converted to (Cu, Ni, Zn)6Sn5 and Cu5Zn8/(Cu, Zn)6Sn5 phases. This current study reveals that the IMC formation in Ni/(Sn-xZn)/Cu sandwich couples are very sensitive to the Zn concentration and thickness in Sn-xZn alloys.