Abstract
The individual roles of and the interactions between two additives, chloride ions and 3-mercapto-1-propanesulfonic acid (MPS), in copper electrochemical deposition from an acidic copper sulfate solution are studied with electrochemical methodologies such as linear sweeping voltammetry (LSV), chronoamperometry, and alternating-current electrochemical impedance spectroscopy (EIS). The LSV results reveal that the current density is not increased by MPS without the presence of chloride in the electrolyte. The EIS results reveal a low-frequency capacitive loop associated with chloride interaction with cupric ions and MPS and a high-frequency capacitive loop related to double-layer charging. A detailed reaction mechanism is proposed, and a mechanistic EIS model based on the reaction mechanism is developed. The EIS model predictions reflect, in a qualitative manner, the features observed in the EIS experimental data.
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