Interaction between microcapsules and crack using XFEM and data-driven fracture toughness predictive model

Abstract

The interaction mechanism between microstructures of materials, including microcrack, inclusion and interface defect, is crucial for studying the microscopic damage of materials. The interaction between microcapsules and cracks in self-healing material is examined using a combination of the extended finite element method (XFEM) and the interaction integral method, which is implemented by a program written in Fortran language. The non-dimensional stress intensity factors (SIFs) of a crack with a single microcapsule, a pair of microcapsules and a cluster of microcapsules are investigated. Moreover, the data-driven fracture toughness predictive model using a genetic programming-based symbolic regression (SR) technique is proposed by training the data from the XFEM program. Results reveal that the non-dimensional SIFs are related to the mechanical property, geometry and interface defect of microcapsule. The influence of microcapsule on the SIF is limited within a distance of five times the microcapsule radius. The predictive model quantifies the contribution of microscopic structures on the macroscopic fracture parameter, highlighting the potential of machine learning in guiding the quantitative design and discovery of high-performance smart materials.