Abstract
Low cycle fatigue tests on as-cast Sn-Ag eutectic solder (96.5Sn-3.5Ag) were carried out using the non-contact strain controlled system at 0.1 Hz with various temperatures (20, 85, 120/spl deg/C). The low cycle fatigue behavior in this temperature range followed the Coffin-Manson equation. The fatigue ductility coefficient was found to be influenced by temperature. Ductility-modified Coffin-Manson could not describe temperature effects on the fatigue behavior. Steps at the boundaries of Sn-dendrites were the initiation sites for microcracks for all temperatures studied. The link up of these cracks and the crack propagation inside the specimen occurred both transgranularly through Sn-Ag eutectic phase and/or Sri dendrite, and intergranularly along Sn-dendrite boundaries. Propagation of stage II crack for different temperatures could be characterized by C*-parameter.
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