Abstract
Time-dependent fracture parameter (C*) and elasto-plastic fracture parameter (J-integral) have been used to correlate low cycle fatigue (LCF) crack growth behavior of Pb-free solder (96.5Sn/3.5Ag) and Pb-containing solder (63Sn/37Pb) under various frequencies (10/sup -3/ - 10/sup -1/ Hz) and temperatures (20, 85, 120/spl deg/C). The results showed that J-integral would not characterize the LCF crack growth of 96.5Sn/3.5Ag under various frequencies and temperatures. However, C* was successfully correlated with the LCF crack growth rate of 96.5Sn/3.5Ag and 63Sn/37Pb. The plots of da/sub c//dt and C* for various frequencies and temperatures were located on a common straight line and in a narrow scatter band. It was confirmed that the LCF process of both solders is dominated by time-dependent mechanism.
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