Abstract
The article discusses the technological process for MEMS sensors manufacturing, which provides the minimum allowable technological defects to achieve MEMS technical characteristics. The paper deals with experiments on the definition of technological operations and the choice of their parameters. The factors influencing the size of technological defects are revealed. There is a technology to manufacture MEMS considered as "silicon on glass." There were successful experiments with the use of mask thickness of 540 nm and 450 nm. The slope of the faces does not exceed 1o, the maximum height of the surface roughness profile was 75 nm.
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