Abstract
PurposeThe purpose of this paper is to address the influence of deposition process parameters. The substrate heating mechanisms are also discussed.Design/methodology/approachDeposition duration, sputtering power, working gas pressure, and substrate heater temperature on substrate heating in the direct current (DC) magnetron sputtering deposition process were investigated.FindingsResults from the experiments show that, in DC magnetron sputtering deposition process, substrate heating is largely influenced by the process parameters and conditions.Originality/valueThis paper usefully demonstrates that substrate heating effects can be minimized by adjusting and selecting the proper sputtering process parameters; the production cost can be reduced by employing a higher sputtering power, lower working gas pressure and shorter deposition duration.
Published Version
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