Abstract
Schottky diodes realized on 4H–SiC n-type wafers with an epitaxial layer and a metal-oxide overlap for electric field termination were studied. The oxide was grown by plasma enhanced chemical vapor deposition (PECVD) and the Schottky barriers were formed by thermal evaporation of titanium or nickel. Diodes, with voltage breakdown as high as 700V and ideality factor as low as 1.05, were obtained and characterized after packaging in standard commercial package (TO220).The electrical properties such as ideality factor, hight barrier, the series resistance Rs were deduced by current/voltage (I–V) analysis using the least mean square (LMS) method. The temperature effect on break voltage, Rs and saturation current was studied. A model based on two parallel Schottky diodes with two barrier heights is presented for some devices having an inhomogeneous contact. It is shown that the excess current at low voltage can be explained by a lowering of the Schottky barrier in localized regions. We use the two series RC components electrical model in order to study the dynamic behaviour of the Schottky diode in low frequency and to improve the effect of barrier inhomogeneities in electrical properties.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call