Abstract
Krypton is sometimes used in physical vapor deposition processes due to its greater atomic mass and size compared to argon, which leads to a lower gas incorporation and may have beneficial effects on kinetics of the coating growth. In this paper, the authors investigate the plasma composition and properties of deposited high power pulse magnetron sputtering Cr-N coatings for discharges with various Ar/Kr ratios and for various pulse lengths of 40 μs, 80 μs, and 200 μs, keeping the average discharge power constant. The results show that an addition of Kr influences the discharge process by altering the ignition and peak values of the discharge current. This influences the metal ion generation and growth conditions on the substrate by reducing the nucleation site densities, leading to a predominantly columnar grow. However, the deposition rate is highest for an Ar/Kr ratio of 120/80. The integral of the metal ion and atom emission exhibits the same trend, having a maximum for Ar/Kr ratio of 120/80. By decreasing the pulse length, the deposition rate of coatings decreases, while the hardness increases.
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