Abstract
In this paper we show an improvement of the power durablity of surface acoustic wave finger electrodes using a metallization layerstack based on Cu in combination with thin Al layers. We investigate the sheet resistance at different annealing temperatures in samples with varying Al layer thicknesses up to 10 nm. The power durability of samples with a very thin Al layer has been increased by ≈ 2 dBm compared with pure Cu metallization. TEM investigation on these samples also shows their thermal stability (after annealing) up to 450°C.
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Schedule a callMore From: IOP Conf. Series: Materials Science and Engineering
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