Abstract

We report on top-gated indium-zinc-oxide (IZO) thin-film transistors (TFTs) with a 3-nm layer of aluminum between the IZO active layer and high-k HfO 2 gate insulator. A series of anneals at 300°C was used to convert the Al metal into Al 2 O 3 , resulting in high-performance top-gated TFTs. The 8-h-annealed TFT with Al layer has a threshold voltage |V T | <; 0.5 V, an ON/OFF ratio of 1 × 10 7 , a subthreshold slope (SS) of 0.14 V/decade, and a saturation mobility μs ~115 cm 2/ V · s in devices with L G = 50μm gate length. For smaller devices with L G = 5 μm, the threshold voltage and SS are similar, but the ON/OFF ratio and mobility are lower. Cross-sectional TEM images and C-V G characteristics with little hysteresis confirm that the thin Al layer, converted in situ into Al 2 O 3 , can protect the IZO channel during processing and produce a good high-k gate-stack.

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