Inductively coupled CH 4 /H 2 plasma etching process for mesa delineation of InAs/GaSb type‐II superlattice pixels

Abstract

An inductively coupled plasma etching process for delineation of InAs/GaSb type-II superlattice pixels is presented. An optimised etch recipe without alternate plasma cleaning step showed an etch rate as high as 0.11 μm/min that results in smooth vertical sidewalls for the type-II superlattice pixel arrays with 10 μm pitch size and 2.4 μm deep trenches. At 70 K, the dark current density for the mesa etched + SU-8 polymer passivated type-II superlattice photodiodes was found to be 0.11 A/cm2 at an applied reverse bias voltage of 0.2 V. The activation energy of 13 meV obtained from the Arrhenius plot and a variable area diode array technique showed that the measured dark current is mainly attributed to bulk tunnelling current. This technique of mesa delineation for the type-II superlattice pixel arrays with small pitch size is a viable option in realising next-generation infrared focal plane arrays.