Abstract
A new method to increase circuit functionality and power density per unit area in power electronic modules has been developed. This new method uses the present power hybrids production technology platform on ceramic substrates and implements direct bonded copper (DBC) partial multilayer structures on application specific substrates. With this novel approach a more than 50% increased power density and a 40% increased circuit complexity has been achieved. Reliability tests (thermal cycling (TC), power cycling (PC), high temperature reverse bias...) have been performed for several new layout solutions, the most relevant results are shown in this paper.
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