In-situ reconditioning mechanism for fixed abrasive pads based on the wear behavior of loose grains

Abstract

C-plane sapphire (α-Al2O3) is a commonly used substrate material for integrated circuits and Light-emitting diodes (LEDs). Efficient, stable, and low-damage lapping processes are used to ensure surface smoothness and meet application requirements. Fixed abrasive pads (FAPs) are typically used for the lapping of sapphire substrates, but the pads are prone to be glazed or even failed. In this study, loose alumina grains were used for in-situ reconditioning of fixed diamond abrasive pads. The material removal rate and surface roughness of the lapped sapphire substrate were calculated, the types and size distributions of the wear debris were analyzed, the surface morphology of the FAP after lapping was examined, and an online monitoring system was used to track the friction coefficient between the FAP and the sapphire substrate. In order to determine the ideal size and concentration of loose grains and to reveal the in-situ reconditioning mechanisms for the fixed diamond abrasive pads, the effects of the size and concentration of loose alumina grains in the lapping slurry on the in-situ reconditioning of the FAP were investigated. This was done by examining the wear behavior of loose alumina grains during the lapping processes of sapphire substrates.