Abstract
The impact of different interfacial layers (ILs) on the electrical performances of Au/Ti/HfO2/Ge0.9Sn0.1 metal oxide semiconductor (MOS) capacitors is studied. Parallel angle resolved x-ray photoelectron spectroscopy measurements show that germanium diffuses into the HfO2 layer when no IL is used. This results in an increase in the tin content at the interface and a high interface state density. We demonstrate that the use of an IL prevents germanium and HfO2 intermixing and improves the electrical performance of MOS capacitors. Several ILs are studied such as alumina (Al2O3) and plasma oxidized GeSn (GeSnOx) prior to HfO2 deposition. C–V measurements correlated with simulations made by a customized analytical model indicate an interface state density of 5 × 1011 eV−1 cm−2 for the HfO2/GeSnOx/Ge0.9Sn0.1 gate stack. This result is promising for the integration of high mobility GeSn channels in CMOS devices.
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