Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate

Abstract

Ag sinter paste joining as a proven die bonding technology have been used in the electric vehicle. However, for the Ag sinter paste joining, metallization layers on substrate are usually necessary such as Ni-P/Au or Ni-P/Ag to get a good bonding quality. The direct bonding on DBC (direct bonded copper) or DBA (Direct Bonded Aluminum) substrates without metallization layers are very attractive. In this study, we investigated the direct bonding on an aluminum (Al) substrate by Ag sinter paste and propose an abrasive blasting processes to treat the Al surface to increase the initial bonding quality. The result show that the shear strength of SiC/Al joint structure by Ag sinter paste can be improved by treating the Al surface. The shear strength of joint structure without surface treatment increased from 26.9 MPa to 32.2 MPa for a strong blasting treatment on Al surface. In addition, the results of thermal shock test (-40 ℃~150℃) also show that the blasting treatment on Al surface can improve the shear strength and reliability of SiC/Al joint structure.