Impact of Si(100) doping methods on TiSi2 formation in vertical and horizontal FET structure areas with increasing aspect ratio

Abstract

Due to the increasing complexity of FET structures and the preferred high trench aspect ratios, demanding process challenges exist, not only in the structuring of the contact trenches, but also in the uniform doping of the diffusion area. Previous investigations have mainly analyzed the doping of horizontal contact areas. For this reason, this paper demonstrates how vertical and horizontal contact areas can be doped through the side wall at the same time. For this purpose, relationships between structural geometry and doping methods are studied in order to structure a multitude of contact trenches next to each other in a functional way, which can realize source and drain trenches. By means of an ion implanted test structure, high doping concentrations of up to 1019 cm−3 could be achieved at a depth of approx. 250 nm below the 2.5 μm deep contact trench bottom. The concentration which can be obtained by PSG diffusion decreases rapidly with increasing Si depth. For the first time, it is shown that the dopant particle concentration of ion implantation increases with trench height and proximity to the trench side wall. Accordingly, the electrical conductivity is also higher and the SR value lower. A positive effect of the near-surface doping concentrations on the subsequent C49-TiSi2 formation could be demonstrated, which enables uniform film growth. In contrast, dopant deposition generates asymmetric dopant concentrations and prevents uniform silicide formation as the aspect ratio increases, thus causing higher diffusion area resistances.