Abstract
This paper presents the impact of process variations in carbon nanotube based advanced bus interconnects such as single walled carbon nanotube (SWCNT), multi walled carbon nanotube (MWCNT) and mixed carbon nanotube bundle (MCB). The impact of temperature variations on paracitics of interconnects for variable interconnects at different technology nodes is analyzed. From the analysis, it reveal that the mixed bundle carbon nanotube offering the lower paracitics even higher temperatures compared to SWCNT and MWCNT which leads to lower delay and crosstalk effect when it is used in bus interconnects. Further we have also done delay analysis by changing the bundle area, number of shells and metallic ratio of three interconnect structures with the insertion of obtained parasitics using empirical formulas. It is proven that the mixed CNT (MCB) interconnect structures offered a lesser delay compared to other CNT interconnect structures. All the analysis has been done using MATLAB at 22nm and 32nm technology nodes.
Published Version
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