Impact of graphene–graphite films on electrical properties of Al2O3 metal–insulator–semiconductor structure

Abstract

The diffusion barrier property of directly grown graphene–graphite films between Al2O3 films and Si substrates was evaluated using metal–insulator–semiconductor (MIS) structures. The roughness, morphology, sheet resistance, Raman spectrum, chemical composition, and breakdown field strength of the films were investigated after rapid thermal annealing. About 2.5-nm-thick graphene–graphite films effectively blocked the formation of the interfacial layer between Al2O3 films and Si, which was confirmed by the decreased breakdown field strength of graphene–graphite film structures. After annealing at 975 °C for 90 s, the increase in the mean breakdown field strength of the structure with the ∼2.5-nm-thick graphene–graphite film was about 91% (from 8.7 to 16.6 MV/cm), while that without the graphene–graphite film was about 187% (from 11.2 to 32.1 MV/cm). Si atom diffusion into Al2O3 films was reduced by applying the carbon-based diffusion barrier.