Immersion Tin Plating Enabling Reliable Wettable Flanks on QFN Packages

Abstract

The automotive market increasingly uses bottom-termination IC packages, like Quad-Flat No leads (QFN) packages, for miniaturization, cost reduction and performance. QFN lead frames are electroplated with 8?12 um of tin for PCB soldering, but subsequent singulation exposes the copper-alloy lead frame at the cut edges. On these exposed lead flanks a solder fillet does not form, making Automatic Optical Inspection (AOI) of solder joints on lead-less packages not reliable. A solder fillet on lead flanks also improves the reliability of solder joints. Therefore, the automotive industry strives for a tin plated wettable flank on lead-less packages. Several approaches, e.g. dimpled or step-cut leads, to create a wettable flank are in use or development. Disadvantage of these methods is that only a part of the flank is tin-plated. Immersion tin plating processes are able to fully plate lead flanks. However, the maximum ~1.5um of standard self-limiting displacement immersion tin processes is too thin to comply with the durability requirements of automotive tin solder finishes. This contribution will discuss an immersion tin-plating process, machine concept and test results for a >2 um tin plated wettable flanks. The immersion tin plating process consist of the following process steps: 1. A high-pressure spray rinse prevents incomplete tin coverage by removing copper burrs formed during singulation. 2. A selective descaling process removes the natural copper oxide film on the exposed copper leads. 3. A selective activation process creates a high tin nucleation density to obtain a fine-grained tin layer. 4. The autocatalytic immersion tin process plates a 2 ? 3um tin layer in 45-60 minutes at 70-75oC. 5. An anti-tarnish process protects the tin layer against oxidation. Finally, rinsing and drying remove all traces of the used chemicals from the packages with tin plated flanks. A machine concept for the immersion tin-plating process is currently under development. The lead-less packages are processed directly on Standard singulation tape rings without repacking or manipulation of the packages. This enables a throughput of 20 tape rings per hour with the full package traceability required for the automotive market. Different types of QFN packages mounted on singulation tape were tin plated and subjected to standard (JEDEC J-STD-002E) solderability tests for component lead durability. Fine-grained 2-3 um thick pure tin deposit of good visual quality were obtained on the exposed QFN copper lead sidewalls with the following properties: • 0.5-1.5um residual tin layer after intermetallic formation in 8 h steam aging and 16 h oven bake. • 100% solder wetting after 6h dry bake at 150C • 100% solder wetting after 8h steam aging (93C and 80-90% RH). • 100% solder fillet height after ceramic glass test.