Hybrid Bonding for the Next Generation of High -Performance Devices

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The electronics industry continues to pursue optimal performance for the insatiable consumer demand of computation intensive products like GPUs, CPUs and AI accelerators. While the monolithic system on chip approach promises exceptional performance, it is costly. The advanced packaging industry has responded to the challenge with 2.5D and 3D integration solutions that bridge the performance gap with heterogeneous integration. Hybrid bonding combined with chiplet architectures within 2.5D will enable the distribution of function and nodes across a chips within a module, providing a path toward more flexible product introduction and innovation. The design and manufacturing of chip-to chip-communication is complex and has some technology dependencies. One technology limitation in realizing a monolithic performance with heterogeneous integration is solder interconnect scalability. Hybrid bonding is a revolutionary platform technology that solves the interconnect scalability problem and delivers enhance performance compared to the conventional Cu microbump. The Direct Bond Interconnect (DBI®), more generally known as hybrid bonding, offers a performance boost that enables novel 3D architectures via disaggregation and chiplet implementation, in spite Moore’s law slowing. The efficient interconnect between circuit functions at the wafer, die and package level, will fuel semiconductor company roadmaps for decades. The performance advantages, ease of integration of such a hybrid interconnect will be discussed in chip to wafer and chip to chip applications. The key areas of innovation anticipated to proliferate the technology within the entire advanced packaging supply chain will be presented.