Abstract
The design of a prototype multichip module utilizing free-space holographic optical interconnects is discussed. This prototype incorporates GaAs laser array chips and silicon CMOS chips which are flip-chip bonded to the transparent MCM substrate. Computer generated holograms are etched onto the opposite side of the MCM substrate to form optical links between lasers and photodetectors that are integrated onto the CMOS chips. Comparisons are then performed between optical interconnects and electrical interconnects showing that for a 5-cm link the dissipated power can be reduced by at least an order of magnitude, for datarates in the range of 700 MHz to 4 GHz, by using optical interconnects.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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