Abstract
Wafer thinning has been effectively used to improve heat dissipation in power devices and to fabricate flexible substrates, small chip packages, and multiple chips in a package. Wafer handling has become an important issue due to the tendency of thinned wafers to warp and fold. Thinned wafers need to be supported during the backgrinding process, lithography, deposition, etc. Temporary wafer bonding using removable adhesives provides a feasible route to wafer thinning. Existing adhesives meet only a partial list of performance requirements. They do not meet the requirements of high-temperature stability combined with ease of removal. This paper reports on the development of a wide range of temporary adhesives to be used in wafer thinning applications that use both novel and conventional bonding and debonding methods. We have developed a series of novel removable high-temperature spin-on adhesives with excellent bonding properties and a wide range of operating temperatures for bonding and/or debonding to achieve a better processing window.
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