Abstract
SiP (system in package), IC cards and RFID (radio frequency identification) tags are more commonly used in digital and mobile devices, such as cell phones, and along with such recent trends, 30–50 μm thick product die are actually used. The thinning of silicon wafers to enhance performance is also in strong demand in power devices used for power conversion, such as IGBTs (insulated gate bipolar transistors) used in solar power generation and hybrid vehicles, which are attracting attention for energy conservation and global environmental protection. This chapter introduces the process technology of making wafers thinner, which also considers wafer handling and use in the subsequent steps, in anticipation of even further thinning of wafers.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
