Abstract
The deposition of high-performance micro-sized ultra-thick silver films is a critical issue. Hollow cathode magnetron sputtering is one of the promising techniques for depositing ultra-thick silver films. A novel cylindrical “three-dimensional magnetron sputtering” (3-DMS) magnet pack presented here was developed based on a conventional hollow cathode magnet pack to deposit high-performance ultra-thick silver film at a high rate. A stable process condition at the average power of 4 kW is realized by the new cylindrical “3-DMS” magnet pack's 137.5 mm diameter targets and a specially designed cooling well. Comparison of deposition rates with different power supplies and at different average power levels are discussed. The behavior of electrons on the target surface in this magnetic field arrangement is investigated using COMSOL Multiphysics software. The composition, topography, mechanical properties and residual stress of the ultra-thick silver film deposited by different sputtering modes (DCMS, HIPIMS, and Pulsed DCMS) are also discussed.
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