Abstract
We report a novel active split structure of low-temperature polysilicon (LTPS) thin film transistor (TFT) on polyimide (PI) substrate showing robust electrical performance under mechanical strain. The compressive and tensile bending tests were carried out with cylinders of radii 3, 2 and 1 mm respectively. The active split TFT exhibits much more stable electrical performance than the conventional TFT. The conventional LTPS TFT shows electrical failure due to the crack generation during tensile or compressive bending test carried out with 1 mm radius cylinder. The split poly-Si islands could resist crack formation/propagation, resulting in a robust electrical performance.
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