Abstract
To use glass as the substrate material in next-generation large-scale integrations and biochips, the high-speed fabrication of high-aspect-ratio microholes is necessary. Transient and selective laser (TSL) processing significantly reduces the processing time per hole. To further improve the processing efficiency, parallel TSL processing using a spatial light modulator is proposed in this study. Two 100-µm depth holes are successfully machined in parallel, in 50 µs. Furthermore, the process control parameters are investigated through high-speed observation and the laser irradiation conditions required for processing are clarified. Parallel processing of three or more holes and depth control of each hole is expected to be realized in future.
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