High temperature high voltage potting adhesive

Abstract

This study presents the results of a new resin survey for potting of high voltage electronics. The main objective consists in improving the European manufacturing capability for high voltage (>6 kV) and high temperature applications (maximum temperature: 180°C). The targeted improvements include enhanced thermal stability and insulation properties of adhesive potting for high voltage applications for a target lifetime of 15 years. In addition, a specific attention has been given to EU sourced materials for development. Class H resins were targeted. A trade-off based on technical data sheets, tests at material, sample and breadboard levels has been conducted. The complete test sequence performed lead to identify a resin suitable for the requirements and processes. TRL4 has been reached, but there is still a long way to go and use it in a space product. The next steps are the implementation of this new resin in the current equipment and the qualification of magnetics parts impregnated or moulded with this resin.