Abstract
The vital role of high-quality-factor (Q) high-frequency (f) dielectric resonators in the growing microwave telecommunication, satellite broadcasting and intelligent transport systems has long motivated the search for new, small size, and lightweight integrated components and packages, prepared by low cost and sustainable processes. One approach is replacing the currently used bulk ceramic dielectrics by thick films of low-sintering-temperature dielectrics fabricated by affordable processes. Here we demonstrate the fabrication of high-Q TiTe3O8 thick films directly on low loss Al2O3 substrates by electrophoretic deposition using sacrificial carbon layer. Nineteen-micrometre-thick TiTe3O8 films on Al2O3 sintered at 700 °C are found to have a relative permittivity εr of 32 and Q × f > 21,000 GHz. Being thus able to measure and provide for the first time the microwave dielectric properties of these films, our results suggest that TiTe3O8 films on Al2O3 substrates are suitable for microlayer microstrip array applications.
Highlights
Microwave dielectric materials play a vital role within a wide range of applications from terrestrial and satellite communication including software radio, Global Positioning Systems (GPS), and Direct Broadcast Satellite (DBS) television and environmental monitoring via satellites
We have extended our previous approach of using sacrificial carbon layers for Electrophoretic deposition (EPD) on fully non-conducting substrates, to fabricate for the first time low sintering temperature high Q dielectric Te based thick films on insulator Al2 O3 substrates
Before alumina substrates are used for EPD, the essential step is to sputter a carbon layer upon it to make them conductive, as explained before
Summary
Microwave dielectric materials play a vital role within a wide range of applications from terrestrial and satellite communication including software radio, Global Positioning Systems (GPS), and Direct Broadcast Satellite (DBS) television and environmental monitoring via satellites. The recent progress in microwave telecommunication, satellite broadcasting and intelligent transport systems (ITS) has resulted in an increasing demand for dielectric resonators (DRs), which are low loss ceramic pucks used mainly in wireless communication devices [1]. With the recent evolution in mobile phone and satellite communication systems, using microwaves as the carrier, the research and development in the field of device miniaturization is needed [4]. This fast-growing mobile/wireless communication industry is demanding small size and lightweight integrated components and packages at low cost. A method to meet these requirements, which are under consideration by the community, is the replacement of the currently used bulk ceramic dielectrics by dielectric thick films [4,5]
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