High heat load properties of actively cooled W/CuCrZr mock-ups by cladding and diffusion bonding with a two-step process

Abstract

The surface of W was grooved into an arc wave surface, on which a Cu layer was then clad at 1150–1200 °C to form a pre-joining clad sample. The clad sample was then diffusion bonded to a CuCrZr at 450 °C to form an actively cooled mock-up. The thermal response and thermal fatigue properties were investigated by active cooling technology. The results showed that no cracks and voids occurred at the interface of W/CuCrZr mock-ups after thermal response test with a heat flux from 0 to 10 MW/m 2, which survived up to 200 cycles under 10 MW/m 2. The residual stresses of the mock-up were estimated by Finite Element Analysis. The simulation results indicated that the residual stresses were more beneficial to crack arrest for the mock-up using an arc wave interface instead of a flat interface. This technique provides an available method of bonding W to CuCrZr.