Abstract
A theoretical analysis to calculate the steady-state temperature distribution within a heat sink configuration, common to two-terminal semiconductor devices used as sources of microwave power, is outlined. The analysis applies to any heat sink configuration provided that it can be modelled as one or more homogenous solid cylinders mounted on a semi-infinite heat sink, where the heat flux incident on both faces of each cylinder is uniform over a given central circular region. Results are presented that show how the maximum temperature rise within the heat sink configuration depends upon the input heat flux and the dimensions of given heat sink materials.
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