Glass Substrates for Advanced Packaging

Abstract

There has been substantial work done in the past few years to apply glass solutions for Advanced Packaging. Advantages of glass based solutions create significant opportunities by leveraging economies of scale, forming substrates at design thickness and leveraging thermal and electrical properties. A lot of work is being done to validate the value of glass as an interposer substrate. The ability to leverage both wafer and panel-based metallization strategies for filling glass vias has been shown. Transitioning these processes to cost-effectiveness and high throughput has shown great promise. The electrical performance of glass relative to silicon at high frequencies makes glass solutions very attractive, particularly in RF applications. Electrical models and characterization have demonstrated the advantages of the insulating properties of glass, and its positive impact on functional performance. Reliability tests show that glass solutions can meet device requirements. The substantial progress and readiness in these areas will be presented. Glass based solutions in panel format provide exciting and cost effective industry opportunities by leveraging economies of scale and glass forming technology. Existing technologies can be used to fill glass vias in a panel format, as well as apply redistribution layers. We will present the status of leveraging panel based technology to enable glass interposers.