Abstract
Co-packaged optics leads to significant power reduction by placing the electronic and photonic chiplets in a single package. An integrated electro-optical substrate made of glass with optical waveguides, through vias and electrical redistribution layers inside a single-sided cavity enables fine-line electrical routing and low-cost assembly. Existing glass and thin film technologies were evaluated and combined into a single process stream including photonic assembly. Photonic chips with silicon nitride waveguides were optically coupled to integrated low-loss (<0.1 dB/cm) glass waveguides with minimum loss of 0.65 dB achieved by fiducial alignment and pick-and-place assembly.
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