Abstract
A new cooling scheme utilizing evaporation from an ultrathin, spatially confined liquid film is described and analyzed for thermal management of hot spots with local heat fluxes in excess of 600 W/cm2. This is achieved by a stable monolayer of liquid maintained on the surface and using fully dry sweeping gas (e.g., air) blown at high velocity (50–100 m/s) above this liquid monolayer. We also demonstrate how dielectric coolants like FC72 can outperform water as an evaporative coolant for this scheme. This work presents the conceptual system design, the results of performance analysis supporting the feasibility of the proposed cooling scheme, and experimental results that demonstrate the idea as well as validate the computational results. The analysis allows one to elucidate the salient physical features of evaporative cooling from spatially confined thin films subjected to a sweeping gas and to identify the key parameters resulting enhanced performance. The simplified model provides results in a form suitable for designing a full-scale cooling device (perspiration nanopatch) that exploits the unique advantages of the proposed cooling scheme.
Published Version
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