Abstract

The use of a very-large-scale integrated GaAs circuits for applications where high speed at room temperatures is needed, such as in computers or telecommunications, is examined. The advantages and disadvantages of a logic family called direct-coupled FET logic (DCFL) which couples the speed of GaAs with a significantly lower power dissipation than any other alternative are discussed. Material, fabrication, and packaging concerns associated with DCFL are considered. Some GaAs devices being produced in volume, at rates of several hundred a month, are described. The potential impact of these devices on the computer and telecommunications markets is addressed.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

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