Four challenges in thermal management in communication devices

Abstract

In this paper describes the four challenges in thermal management in communication devices. Four challenges in the electronic packaging industry are challenges in the cooling of three dimensional packages, challenges resulting from thermally induced warpages, thermal challenges arising from spreading and interface resistances and thermal challenges in the implementation of lead free solder. In three dimensional packaging technologies are now emerging field, in which tremendous reduction size and weight of wireless handheld devices. Thermally induced warpage become one of the major concerns in the automated manufacturing and assembly of multilayered PWBs. One of the big challenge in electronic packaging industry is to implement lead free solder alloy. Tin/silver/copper alloys are introduced as lead free solder in packaging.