Formulation of mathematical model for improved heat transfer in heat sink electronic system

Abstract

Abstract In this research work, a mathematical model was formulated to establish a relationship between thermal conductivity and other physical parameters with the aim of improving thermal conductivity and thermal stability for heat sink applications. The proposed model was validated considering three composite materials namely aluminium graphene, aluminium graphite and copper graphite. This proposed model provides some dominating parameters that affect the thermal efficiency of the composite. The results obtained with this model are in close agreement with the experimental data. The variables considered in the model were converted to dimensionless number by employing Buckingham pi theorem which gave rise to dimensionless efficiency parameter (Y) and process parameter (X). Thus, model establishes unique exponent for each material in identifying distinct features and physical significance in selection of heat sink material.