Abstract

In microelectronics packaging, minimizing thermomechanical stresses is crucial to achieve high reliability. This paper presents a novel approach for flip-chip interconnects, utilizing individual metal-coated polymer spheres at a low bonding temperature. The method involves selectively depositing individual conductive particles onto a polydimethylsiloxane (PDMS) carrier and then transferring the particles to electrical pads on substrate using Ag sintering followed by die placement and introducing underfill material. The deposition process achieved a high yield of 98.8% on the PDMS carrier, while the transferring process resulted in well-defined ink dots with a yield of 96.2%. The sintered Ag formed good bonds between the particles and electrical pads, leading to moderate interconnect resistance (as low as 0.57 Ω). This work has demonstrated the feasibility of interconnects based on a single metal-coated polymer sphere with low thermomechanical stress induced, thanks to the low bonding temperature (140 °C) and pressure (0.1 MPa) as well as the mechanical compliance of polymer particles.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.