Finite Element Simulation of Thermal Residual Stresses in Joining Ceramics with Thin Metal Interlayers

Abstract

Finite element analysis was used to estimate thermal residual stresses developed in silicon nitride bodies bonded by metallic interlayers. Stresses were calculated for various characteristic metals, namely, Ni, Al, and Si, assuming elastic and elastic‐plastic behavior. The relative importance of the metal properties, such as thermal expansion coefficient, stiffness and ductility, has been evaluated. Two different joint geometries, butt and lap, have been used in stress calculations, and special care was taken in the mesh generation, to obtain comparable results. The yield stress of the interlayer material rather than thermal expansion mismatch is the critical factor in thermal residual tensile stress buildup inside ceramic adherents.