Abstract
A 462-pin PGA (pin-grid-array) package that has 636- mu m pin pitch is described. The package substrate and heat sink are made of AlN ceramic. An LSI chip is attached directly on the heat sink. The package has a thermal impedance of less than 0.1 degrees C/W because of the high thermal conductivity of AlN. Further, the thermal coefficients of expansion of AlN and Si are closely matched. The package is 17 mm/sup 2/ and 3.55 mm high. By using 100- mu m-pitch tape-automated-bonding (TAB) technology for both inner lead bonding (ILB) and outer lead bonding (OLB), the maximum size chip mountable on the package is 13.5 mm/sup 2/. The area ratio of package to chip is 1.6, a factor of 3 to 5 better than conventional packages.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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